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Instrument >> Instrument for Wafer >> Semi-Automatic Contactless Wafer Detector:HS-NCS-200SA
                

 

Products Brief:

       Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm

 

Product's Feature:

Non-contact Measurements.

Semi-automation system, can improve the measure thoughput.
Can be used on all wafer materials including: Silicon
Gallium-Arsenide,Indium Phosphide,Germanium.
Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes.
Thickness and TTV values are indicated on the high resolution LCD display.
Provides High Performance at Low Cost.
Menu-driven for Fast, Easy Setup.
High-resolution LCD Display.
RS-232 Output Port to PC.
Parallel Port for Printer.
Portable and Easy to Set Up
provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
On-board Microprocessor for Accurate, Repeatable Measurements.
Teflon Wafer Stage for Easy, Non-abrasive Positioning.


Technique Specification:

Wafer Sizes: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm

Measurement Range: 1mm standard [1.7 mm Extended]
Thickness Accuracy: +/-0.25um
Repeatability:
0.050um

TTV Accuracy: +/-0.05um
Repeatability:
0.050um

Bow Range: +/-500um [+/-850um]
Accuracy :+/-2.0um
Repeatability: 0.750um

Material:SiliconGallium-Arsenide,Indium PhosphideGermanium.

Surfaces: As-cut, Lapped, Etched, Polished, Patterned.

Flat/Notch: All SEMI Standard Flat(s) or Notch.

Conductivity: P or N Type.

Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.

Continuous and 5-point Measurement.

 

Application :

Slicing

>>Saw set-up

    >>>Thickness

    >>>TTV

>>Degradation monitoring

>>>Wire guide re-grooving

>>>Blade replacement

Lap/etch and polishing

>>Process monitoring

>>Thickness

>>TTV

>>Material removal

>>Bow

>>Warp

>>Flatness

Backgrind

>>Removal rate

Final Inspection

>>Lot sampling

>>Final thickness


Typical Customer:

American,Europe and Asia and so on.

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