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Non-contact wafer tester

手動無接觸硅片測試儀

 

 

Products Brief:
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, it measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.

 

 


Product's Feature


 

Non-contact measurement
Material:Si, GaAs, InP, Ge, etc.
Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes.
Thickness and TTV values are indicated on the high resolution LCD display.
Provides High Performance at Low Cost.
Menu-driven for Fast, Easy Setup.
On-board Microprocessor for Accurate, Repeatable Measurements.
Teflon Wafer Stage for Easy, Non-abrasive Positioning.


 

Technique Specification

Wafer Size: 50mm-300mm.
Thickness range: 0-1000 um
Thickness accuracy: + /-0.25um
TTV Measurement accuracy: + /-0.05um
Bow range: + /-500um [+ /-850um]
Bow accuracy: + /-2.0um
 

 

Application

Slicing

Saw set-up

    Thickness

    TTV

Degradation monitoring

Wire guide re-grooving

Blade replacement

Lap/etch and polishing

Process monitoring

Thickness

TTV

Material removal

Bow

Warp

Flatness

Backgrind

Removal rate

Final Inspection

Lot sampling

Final thickness

 




Typical Customer:

American,Europe and Asia and so on.